Defects in and device properties of semi-insulating GaAs
It is well known that there are many arsenic precipitates in LEC GaAs,
the dimensions of which are 500-2000 AA. The authors have recently
found that these arsenic precipitates affect the device properties of
chloride epitaxial-type MESFETS. They also affect the formation of small
surface oval defects on MBE layers. To reduce the density of these
arsenic precipitates, a multiple-wafer-annealing (MWA) technology has
been developed in which wafers are annealed first at 1100 degrees C and
then at 950 degrees C. By this annealing, highly uniform substrates with
low arsenic precipitate densities, uniform PL and CL, uniform
microscopic resistivity distributions and uniform surface morphology
after AB etching can be obtained. These MWA wafers
showed low threshold voltage variations for condensed
ion-implantation-type MESFETS. In the present paper recent works are
reviewed and the mechanism of arsenic precipitation is discussed from
the viewpoint of stoichiometry.
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